Full-liquid W45 direct-to-chip (fanless) · two-loop · 3× ground-skid dry coolers — NVIDIA GB300 NVL72 · ~810 kW IT · 1 MW / 2 MWh BESS · 800VDC-ready · Permian Basin, TX.
Rev P2 engineering package for a containerized GPU data-center module. Full-liquid W45 direct-to-chip cooling — 100% liquid, fanless, no RDHx — is the default basis.
DI / 25% PG to the rack cold plates — 40 °C supply, 52–55 °C return. 1182 LPM on a DN125 header.
25% PG glycol — 45 °C supply, 57 °C return to the dry coolers.
The 40 ft High-Cube envelope is retained for the overhead tray/pipe zone. The end elevation shows the skid on grade beside the container with the FWS penetration.
Earlier “liquid-cooled” servers were hybrid: cold plates on GPU/CPU only. Memory, NICs, NVSwitch, PSUs and VRMs still rejected heat to air → fans, perforated bezels, RDHx.
The unsolved problem: cool 100% of the board on liquid. NVIDIA’s Rubin answer: liquid to every chip via a single tray inlet/outlet → sealed front, no fans, 6U→2U.
Our original GB300 basis (~90% liquid + ~10% air → 6× RDHx) was that hybrid approach — at Rev P2 the 100%-liquid answer is the default.
| Metric | hybrid (legacy) | full_liquid — P2 default |
|---|---|---|
| Architecture | ~90% liquid + air | 100% liquid, fanless |
| RDHx / fans | 6 / required | 0 / none |
| Liquid load | 729 kW | 810 kW |
| TCS flow · header | 1062 LPM · DN125 (std) | 1182 LPM · DN125 |
| Total rejection | ~850 kW (heat balance) | ~850 kW (heat balance) |
| Front service aisle | 920 mm — FLAG | 1100 mm — OK |
Removing the 180 mm RDHx opens the aisle 920 → 1100 mm — every clearance clears.
Energy. ~4% cooling-cost cut per +1 °C loop temperature; >$4M/yr at 50 MW → order ~$65k/yr here (climate-dependent).
Claim language. “Closed-loop with minimal adiabatic trim” — never “water-free.”
Part of the Rev P2 basis: a 1 MW / 2 MWh LFP skid off the electrical end, sited at 3.0 m from the compute container per NFPA 855 (2026). Shown in the 3D model, GA, IFC and isometric; storage node + ride-through note on the single-line.
Two payoffs: ERCOT 4CP peak-shave / ancillary-services revenue, and thermal ride-through for the fanless default — there is no air fallback. Price = ESTIMATE.
| Entity | IFC class |
|---|---|
| IT racks | IfcBuildingElementProxy |
| Plate-HX (CDU integral) | IfcHeatExchanger |
| CDUs | IfcUnitaryEquipment |
| FWS pumps | IfcPump |
| Dry coolers | IfcCoolingTower |
| TCS / FWS headers | IfcPipeSegment |
| Electrical gear | IfcElectricDistributionBoard |
Container interior = IfcSpace; floor/roof/walls = IfcSlab / IfcWall; BESS = IfcElectricFlowStorageDevice. Pset_ConceptBasis carries the Rev P2 basis: CDU CoolIT CHx1000, heat balance, future-proofing. Every shaped entity meshes with valid geometry.
The full-liquid default removes the 180 mm RDHx → front aisle 920 → 1100 mm. The legacy hybrid variant (./out_hybrid) retains its historical 920 mm / rear-aisle flags — one driver for the P2 default flip.
| Check | Target (mm) | Actual (mm) | Result |
|---|---|---|---|
| Electrical bay NEC 110.26 (480 V) | 1067 | 1500 | OK |
| IT front service aisle | 1067 | 1100 | OK |
| Overhead tray/pipe zone | 300 | 346 | OK |
| Rear access (no RDHx) | 0 | 50 | OK |
| Length far-end spare | ≥0 | 2111 | OK |
The self-contained 40 ft module is the product — scale a site by replicating it.
The open ESTIMATE flags: dry-cooler count basis (3/module), CDU capacity-at-approach, BESS price, PUE band.